
| Kapa inoa: | HeltecBMS |
| Material: | Papa PCB |
| palapala hōʻoia: | CE/FCC/WEEE |
| kumu: | ʻĀina nui Kina |
| Palapala hoʻokō: | Hookahi makahiki |
| MOQ: | 1 pc |
| APP Mobile: | Kākoʻo IOS / Android |
| ʻAno pākaukau: | LTO/NCM/LFP |
| ʻAno kaulike: | Hoʻohālikelike ʻeleu |
1. 4-8S Smart BMS *1 hoʻonohonoho.
2. ʻeke anti-static, anti-static sponge a me ka pahu corrugated.
| ʻIkepili ʻenehana | Hoʻohālike | |||
| HT-8S1A100 | HT-8S1A200 | HT-8S2A200 | ||
| Ka helu o nā kaula pilahi | Li-ion | 3-8S | ||
| LiFePo4 | 4-8S | |||
| LTO | 6-8S | |||
| Keʻano kaulike | Kauna ʻeleu (Ka Mokuʻāina piha ʻia) | |||
| Kaulike i kēia manawa | 1A | 2A | ||
| Kū'ē Conductive ma ka Kaapuni Nui | 0.3mΩ | |||
| Hoʻokuʻu mau i kēia manawa | 100A | 200A | ||
| Ka Uku Hoʻomau | 100A | 200A | ||
| MAX Hoʻokuʻu ʻia (2min) | 200A | 350A | ||
| ʻOi aku ka palekana o kēia manawa (ADJ) | 10-100A | 10-200A | ||
| Nā Interface ʻē aʻe (Default) | RS485 | |||
| Nui (mm) | 153*136*18 | |||
| Hoʻopuka Wiring | awa maʻamau | Awa hoʻokaʻawale | ||
| Palena Voltage Pakahi | 1-5V | |||
| Ka Pono Loaʻa Voltage | ±5mV | |||
| Ka Voltage Palekana ʻOi | 1.2-4.35V Hiki ke hoʻololi | |||
| Ka Voltage Hoʻokuʻu Hoʻokuʻu Nui | 1.2-4.35V Hiki ke hoʻololi | |||
| Ma luna o ka lohi ʻike i kēia manawa | 2-120S Hiki ke hoʻololi | |||
| Ma luna o ka hoʻokuʻuʻana i ka Voltage Palekana | 1.2-4.35V Hiki ke hoʻololi | |||
| Ma luna o ka hoʻokuʻuʻana i ka Voltage | 1.2-4.35V Hiki ke hoʻololi | |||
| Pale ʻia ʻo Temp | ʻAe | |||
| Pale Kaapuni Pokole | ʻAe | |||
| Helu Coulomb | ʻAe | |||